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SMTA華東高科技會(huì)議—iNEMI低溫焊接技術(shù)工作坊
 
4月24日，上海世博展覽館 9號(hào)會(huì)議室
 
         工業(yè)界正在嘗試探索采用低溫焊料組裝手機(jī)、平板電腦和移動(dòng)電腦等消費(fèi)電子產(chǎn)品。將錫銀銅（SAC）焊膏的峰值回流溫度從當(dāng)前240℃以上的水平降低，由此帶來經(jīng)濟(jì)性、環(huán)境和技術(shù)上的優(yōu)勢。低溫焊接還為新興市場如超移動(dòng)計(jì)算、可穿戴設(shè)備和物聯(lián)網(wǎng)（IOT）提供了一種潛在的解決方案，以減少更小、更薄和高度集成的電子設(shè)備的組裝中的動(dòng)態(tài)翹曲。將回流峰值溫度降低到200℃以下可以降低能耗，提高表面貼裝良率，但同時(shí)也需要新的焊接材料具備良好的可靠性和工藝性。
 
iNEMI技術(shù)工作坊鼓勵(lì)與會(huì)者在研討中互動(dòng)，討論和分享有關(guān)低溫焊料的信息和經(jīng)驗(yàn)，例如：              
· 低溫焊料材料和技術(shù)的新發(fā)展和未來計(jì)劃
· iNEMI基于錫鉍的低溫焊接工藝和可靠性項(xiàng)目報(bào)告
· 提高產(chǎn)量和質(zhì)量所需的研究創(chuàng)新
· 未來產(chǎn)品和技術(shù)的要求對(duì)焊錫材料和工藝的影響
· 低溫焊錫材料的工藝性、可靠性和失效分析
· 討論新的合作項(xiàng)目機(jī)會(huì)，推動(dòng)低溫焊錫技術(shù)在行業(yè)中的開發(fā)和部署
 
         本次專項(xiàng)研討會(huì)的目標(biāo)人群是致力于開發(fā)和鑒定新型低溫焊料解決方案的電子制造商、研究人員和供應(yīng)商，您將有機(jī)會(huì)和他們會(huì)面并分享和討論。
 
議程計(jì)劃

時(shí)間	議題	演講嘉賓
9:30 – 9:45	簽到
9:45 – 10:00	歡迎及研討會(huì)簡介	傅浩博士，iNEMI國際電子生產(chǎn)商聯(lián)盟
10:00 – 10:30	使用低溫焊接的表面貼裝技術(shù)	Kok Kwan Tang，CPTD 技術(shù)項(xiàng)目經(jīng)理， Intel英特爾
10:30 – 10:55	電子封裝中的低溫焊接合金系統(tǒng)	沈駿教授，博導(dǎo)， 重慶大學(xué)
10:55 – 11:20	iNEMI基于錫鉍的低溫焊接工藝和可靠性項(xiàng)目報(bào)告, 傅浩博士, 亞太區(qū)及項(xiàng)目管理總監(jiān), iNEMI國際電子生產(chǎn)商聯(lián)盟
11:20 – 11:45	題目待定	戴爾
11:45 – 13:00	午餐
13:00 – 13:25	新一代SMT低溫焊接材料的開發(fā)	Naoki Kubota，技術(shù)銷售專員，田村電子
13:25 – 13:50	用于SMT的低溫焊接”	Domini Zhang，運(yùn)營工程經(jīng)理，偉創(chuàng)力
13:50 – 14:15	先進(jìn)的表面貼裝無鉛低溫焊接材料	Watson Tseng，研發(fā)副總裁，美國總經(jīng)理，昇貿(mào)科技
14:15 – 14:30	茶歇
14:30 – 14:55	用于下一代裝配的高可靠低溫焊接合金	Annie Yang，中國區(qū)市場經(jīng)理，麥德美愛法
14:55 – 15:20	電子裝配中的低溫焊接技術(shù) — 對(duì)裝配和可靠性的挑戰(zhàn)	尚攀舉博士，資深工程師，華為
15:20 – 15:45	優(yōu)諾LTS解決方案和應(yīng)用實(shí)踐 — NWO的解決與LTS混合焊點(diǎn)評(píng)價(jià)新方法	陳欽，研發(fā)經(jīng)理，蘇州優(yōu)諾
15:45 – 16:00	茶歇
16:00 – 16:20	座談專家簡報(bào)
16:20 – 17:00	座談問答
17:00 – 17:15	總結(jié)

 
 
報(bào)名注冊              
 早鳥票（3月31日前）：760元人民幣，
常規(guī)票（3月31至4月18日前）： 900元人民幣
*登記費(fèi)包括會(huì)議報(bào)告的材料、午餐券、咖啡/茶和水。              
 
人民幣（支付）：
賬戶名： 澳龍信息科技（上海）有限公司
賬號(hào)：   310066865018010020955
收款行： 交通銀行上海市分行張江支行
 
開票事宜請(qǐng)聯(lián)系：sammulw@infosalons.com.cn 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
iNEMI Low-Temperature Solder Workshop – SMTA China East Conference
 
Join iNEMI at NEPCON China in Shanghai to discuss new developments and future plans for low-temperature solder materials and techniques.
 
iNEMI Low-Temperature Soldering Workshop
Held at 2019 SMTA China East Conference
Shanghai World Expo Exhibition and Convention Center
Wednesday, April 24 / 9:00-16:45 / Meeting room #9
 
Industry is exploring the adoption of low-temperature solder for the assembly of consumer electronic products, such as cell phones, tablets and mobile computers. Lowering peak reflow temperature from the current 240oC+ level for SnAgCu (SAC) solder paste has economic, environmental and technical benefits. Low-temperature soldering also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages for emerging markets such as ultra-mobile computing, wearable devices and Internet of Things (IoT). Lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields, but it also requires a new class of reliable soldering materials and processes.
 
This iNEMI workshop will provide an interactive forum where participants can discuss and share information about low-temperature solder such as:
· New developments and future plans for low-temperature solder materials and techniques
· Results from iNEMI’s BiSn-Based Low-Temperature Soldering Process and Reliability project
· Innovations required to improve yield and quality
· Impact of future product and technology requirements on solder materials and processes
· Processability, reliability and failure mechanisms of low-temperature solder materials
· Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry
This workshop gives you the opportunity to meet and network with leading electronics manufacturers, researchers and suppliers who are working to develop and qualify new low-temperature solder solutions.
 
Registration
Early bird registration is USD$100 (CNY 760) until March 31, after which the fee is $120 (CNY 900). The registration fee covers workshop presentations, lunch coupon, coffee/tea breaks and water.
Click here for additional details, including agenda and registration.
https://community.inemi.org/ev_calendar_day.asp?date=4/24/2019&eventid=257 
Preliminary Agenda

Time		Topic	Speaker
9:30 – 9:45		Sign for workshop attendance
9:45 – 10:00		Welcome and Workshop Overview	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
10:00 –10:30		Surface Mount Technology Using Low Temperature Soldering	Kok Kwan Tang, CPTD Technical Program Manager, Intel
10:30 –10:55		Low Temperature Solder Alloy System in Electronic Packaging	Dr. Jun Shen, Professor, PhD Advisor, Chongqing University
10:55 –11:20		iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability Project Report	Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI
11:20 –11:45		Presentation title & speaker TBC	Dell
11:45 –13:00		Lunch
13:00 –13:25		Development of Low Temperature Solder for Next Generation SMT	Naoki Kubota, Technical Sales Specialist, Tamura
13:25 –13:50		Low Temperature Solder for SMT	Domini Zhang, Operations Engineering Manager, Flex
13:50 –14:15		Advanced Low Temp Lead-free Solder for SMT Assembly	Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology
14:15 –14:30		Tea break
14:30 –14:55		High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies	Annie Yang, Regional Marketing Manager – China, MacDermid Alpha
14:55 –15:20		Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges	Dr. Panju Shang, Senior Engineer, Huawei
15:20 –15:45		Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint Evaluation	Qin Chen, R&D Manager, Eunow
15:45 –16:00		Tea break
16:00 –16:20		Presentation from panel list
16:20 –17:00		Panel discussion
17:00 –17:15		Wrap up